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1
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Tae Kyu Lee, | 대한금속재료학회 | 2006 ,
2
Accurate Extraction of Crosstalk Induced Dynamic Variation of Coupling Capacitance for Interconnect Lines of CMOSFETs
Accurate Extraction of Crosstalk Induced Dynamic Variation of Coupling Capacitance for Interconnect Lines of CMOSFETs
Yong Goo-Kim, Hee-Hwan Ji, Hyung Sun Yoon, Sung H, | 대한전자공학회 | 2004 ,
3
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
4
Decentralized Control for Multimachine Power Systems with Nolinear interconnections and Disturbances
Decentralized Control for Multimachine Power Systems with Nolinear interconnections and Disturbances
Kyu-Il Jung, Kwang-Youn Kim, Tae-Woong Yoon, Gils, | The Korean Institute of Electrical Eng. | 2005 ,
5
Design of Robust Hoo Control for Interconnected Systems : A Homotopy Method
Design of Robust Hoo Control for Interconnected Systems : A Homotopy Method
Ning Chen, Masao Ikeda, Weihua Gui, | The Korean Institute of Electrical Eng. | 2005 ,
6
(국도7호선)남북연결도로 건설지 = National highway line 1 South-North Korea inter-connection project
(국도7호선)남북연결도로 건설지 = National highway line 1 South-North Korea inter-connection project
건설교통부 서울지방국토관리청., 534.1-건53나-R | 서울지방국토관리청 | 2004 534.1-건53나-R,
7
Using Minimal Path Sets for the Evaluation of the Reliability of DRDT Interconnection Networks
Using Minimal Path Sets for the Evaluation of the Reliability of DRDT Interconnection Networks
임재학, 이종형, 조병엽, | 한국품질경영학회 | 2000 ,
8
(국도1호선) 남북연결도로 건설지 = National highway line 1 South-North Korea inter-connection project
(국도1호선) 남북연결도로 건설지 = National highway line 1 South-North Korea inter-connection project
건설교통부 서울지방국토관리청., 534.1-건5323나-R | 서울지방국토관리청 | 2003 534.1-건5323나-R,
9
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
10
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Young Bae Park,Duk Won Lee, | 대한금속.재료학회 | 2001 ,
처음12이후마지막
1
Journal of Interconnection Networks
World Scientific Publishing Company [, ]