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Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
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MARC
008000107s2001 ULKa a ENG■022 ▼a12259438
■245 ▼aPackage- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers▼d공저 Young Bae Par, Dok Won Lee
■260 ▼a서울▼b대한금속.재료학회▼c2001.
■300 ▼app. 493-498
■653 ▼aPACKAGE▼aWAFER▼aLEVEL▼aELECTROMIGRATION▼aTEST▼aALCU▼aINTERCONNECT▼aUNDERLAYERS
■700 ▼aYoung Bae Par, Dok Won Lee
■773 ▼tMetals and Materials▼gVOL.7 NO.5 (2001 OCTOBER)▼d2001, 10
■SIS ▼aS009188▼b60013551▼h8▼s2
