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Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
상세정보
- 자료유형
- 기사
- ISSN
- 12269360
- 서명/저자
- Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via / Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho Lee, Tae Sung Oh
- 발행사항
- 서울 : 한국마이크로전자및 패키징학회, 2005.
- 형태사항
- pp. 111-120
- 키워드
- INTERCONNECTION PROCESS ELECTRICAL PROPERTIES INTERCOMECTION JOINTS 3D STACK PACKAGE 75UM CU VIA
- 기본자료저록
- 마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack : 2005 Vol. 12 No.2 ((35)) 2005, 06
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075297
MARC
008060503s2005 ULKa a KOR■022 ▼a12269360
■245 ▼aInterconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via▼dKwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho Lee, Tae Sung Oh
■260 ▼a서울▼b한국마이크로전자및 패키징학회▼c2005.
■300 ▼app. 111-120
■653 ▼aINTERCONNECTION▼aPROCESS▼aELECTRICAL▼aPROPERTIES▼aINTERCOMECTION▼aJOINTS▼a3D▼aSTACK▼aPACKAGE▼a75UM▼aCU▼aVIA
■700 ▼aKwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho Lee, Tae Sung Oh
■773 ▼t마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack▼g2005 Vol. 12 No.2 ((35))▼d2005, 06
■URL ▼ahttp://www.imapsk.or.kr
■SIS ▼aS023545▼b60075252▼h8▼s2
