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1
English Historical Linguistics and Philology in Korea
English Historical Linguistics and Philology in Korea
Park Young-Bae, | 한국영어사학회 | 1996 ,
2
Econometric Methods And Purchasing Power Parity
Econometric Methods And Purchasing Power Parity
Park Young-Bae, | 국제지역학회 | 2006 ,
3
Robust background maintenance by estimating global intensity level changes for dynamic scenes
Robust background maintenance by estimating global intensity level changes for dynamic scenes
Youngbae Hwang, | Springer | 2009 ,
4
A study on consistency and accuracy of pulse diagnosis in Eight-Constitution Medicine
A study on consistency and accuracy of pulse diagnosis in Eight-Constitution Medicine
Yong-Sup Shin, | Kyung Hee University Press | 2009 ,
5
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Shin Bok Lee, Young Ran Yoo, Ja-Young Jung, Young, | 한국마이크로전자및 패키징학회 | 2005 ,
6
Effects of Temperature Amplitude an Loading Frequency on Alternating Current-Induced Damage in Cu Thin Films
Effects of Temperature Amplitude an Loading Frequency on Alternating Current-Induced Damage in Cu Thin Films
Young-Bae Park, | 한국마이크로전자및 패키징학회 | 2005 ,
7
Effect of Microstructure on Alternating Current-induced Damage in Cu Lines
Effect of Microstructure on Alternating Current-induced Damage in Cu Lines
Young Bae Park, | 한국마이크로전자및 패키징학회 | 2005 ,
8
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Young Bae Park,Il Young Yoo, | 대한금속.재료학회 | 2001 ,
9
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Young Bae Park,Duk Won Lee, | 대한금속.재료학회 | 2001 ,
10
Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Young Bae Park,Jin Yu, | 대한금속.재료학회 | 2001 ,
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