서브메뉴
검색
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
상세정보
- 자료유형
- 기사
- ISSN
- 12269360
- 서명/저자
- Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB / Shin Bok Lee, Young Ran Yoo, Ja-Young Jung, Young-Bae Park, Young-Sik Kim, Young-Chang Joo
- 발행사항
- 서울 : 한국마이크로전자및 패키징학회, 2005.
- 형태사항
- pp. 167-174
- 기본자료저록
- 마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack : 2005 Vol. 12 No.2 ((35)) 2005, 06
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60075307
MARC
008060503s2005 ULKa a KOR■022 ▼a12269360
■245 ▼aInfluence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB▼dShin Bok Lee, Young Ran Yoo, Ja-Young Jung, Young-Bae Park, Young-Sik Kim, Young-Chang Joo
■260 ▼a서울▼b한국마이크로전자및 패키징학회▼c2005.
■300 ▼app. 167-174
■653 ▼aINFLUENCE▼aPOLARIZATION▼aBEHAVIORS▼aECM▼aCHARACTERISTICS▼aSNPB▼aSOLDER▼aALLOYS▼aPCB
■700 ▼aShin Bok Lee, Young Ran Yoo, Ja-Young Jung, Young-Bae Park, Young-Sik Kim, Young-Chang Joo
■773 ▼t마이크로전자 및 패키징 학회지=Journal of the Microelectronics and Pack▼g2005 Vol. 12 No.2 ((35))▼d2005, 06
■URL ▼ahttp://www.imapsk.or.kr
■SIS ▼aS023545▼b60075252▼h8▼s2
