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393 Results:AA:Y D BAE 0.218 sec.
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381
A Single DOF Magnetic Levitation System using Time Delay Control and Reduced-Order Observer
A Single DOF Magnetic Levitation System using Time Delay Control and Reduced-Order Observer
Jung Soo Choi,Yoon Su Baek, | 대한기계학회 | 2002 ,
382
Nondestructive Evaluation of the Characteristics of Degraded Materials Using Backward Radiated Ultrasound
Nondestructive Evaluation of the Characteristics of Degraded Materials Using Backward Radiated Ultrasound
Sung D Kwon,Sung J Song,Dong H Bae,Young Z Lee, | 대한기계학회 | 2002 ,
383
Numerical Analysis of Welding Residual Stress Using Heat Source Models for the Multi-Pass Weldment
Numerical Analysis of Welding Residual Stress Using Heat Source Models for the Multi-Pass Weldment
Dong Ho Bae,Chul Han Kim,Seon Young Cho,Jung Kyun, | 대한기계학회 | 2002 ,
384
Modeling and Motion Control of Mobile robot for Lattice Type Welding
Modeling and Motion Control of Mobile robot for Lattice Type Welding
Yang Bae Jeon, | 대한기계학회 | 2002 ,
385
Force Distribution of a Six-Legged Walking Robot with High Constant Speed
Force Distribution of a Six-Legged Walking Robot with High Constant Speed
Kwang Suk Jung,Yoon Su Baek, | 대한기계학회 | 2000 ,
386
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
387
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Young Bae Park,Il Young Yoo, | 대한금속.재료학회 | 2001 ,
388
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Young Bae Park,Duk Won Lee, | 대한금속.재료학회 | 2001 ,
389
Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Young Bae Park,Jin Yu, | 대한금속.재료학회 | 2001 ,
390
Fabrication of Al Alloys Reinforced with AIN Particles Formed by In-Situ Reaction
Fabrication of Al Alloys Reinforced with AIN Particles Formed by In-Situ Reaction
Kon Bae Lee,Ho Seop Sim,Sung Woo Heo,Soo Youn Cho, | 대한금속.재료학회 | 2000 ,
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