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1
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM
Yong Min Kwon, | 대한금속재료학회 | 2006 ,
2
Electromigration Behaviors of SnAgCu Solder Lines
Electromigration Behaviors of SnAgCu Solder Lines
Min Seung Yoon, | 대한금속재료학회 | 2006 ,
3
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Young Kun Jee, | 대한금속재료학회 | 2006 ,
4
Support vector machine-based solder joint inspection
Support vector machine-based solder joint inspection
Yun Tae Soo, 566-Y95s-TD | The Graduate School Kyungpook National University | 2000 566-Y95s-TD,
5
Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles
Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles
Jeong-Hwan Kim, Ji-Whan Ahn, | 한국암반공학회 | 2004 ,
6
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung, | Metals and Materials | 2005 ,
7
Effects of Bismuth on Growth Kinetics of Intermetallic Compounds in Sn-3.5Ag Solder Joints : AGrowth Kinetic Model
Effects of Bismuth on Growth Kinetics of Intermetallic Compounds in Sn-3.5Ag Solder Joints : AGrowth Kinetic Model
Joo-Youl Huh, Sang-Uk Han, Chang-Yong Park, | 대한금속.재료학회 | 2004 ,
8
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Jong-Hyun Lee,Dong-Hyuk Shin,Yong-Seog Kim, | 대한금속.재료학회 | 2003 ,
9
A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials
A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials
Youn-Eui Shin,Jun-Hwan Lee,Young-Wook Koh,Chong-W, | 대한기계학회 | 2002 ,
10
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Jin-Won Choi,Ho-Seob Cha, | 대한금속.재료학회 | 2003 ,
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