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Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles
Rheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles
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MARC
008060428s2004 ULKa a ENG■022 ▼a12269328
■245 ▼aRheological Properties of Solder Paste Containing Lead-free Solder Particles Coated with Polymer Wax Particles▼dJeong-Hwan Kim, Ji-Whan Ahn
■260 ▼a서울▼b한국암반공학회▼c2004.
■300 ▼app. 63-68
■653 ▼aRHEOLOGICAL▼aPROPERTIES▼aSOLDER▼aPASTE▼aCONTAINING▼aLEADFREE▼aPARTICLES▼aCOATED▼aPOLYMER▼aWAX
■700 ▼aJeong-Hwan Kim, Ji-Whan Ahn
■773 ▼tGeosystem Engineering▼g2004 September (Vol.7 No.3)▼d2004, 09
■URL ▼ahttp://www.ksge.or.kr
■SIS ▼aS013497▼b60053900▼h8▼s2


