MARC

 008031223s2003        ULKa    a                          ENG
■022    ▼a12259438
■245    ▼aDissolution  of  Cu  Into  Sn-Bases  Solders  during  Reflow  Slldering▼dJong-Hyun  Lee,Dong-Hyuk  Shin,Yong-Seog  Kim
■260    ▼a서울▼b대한금속.재료학회▼c2003.
■300    ▼app.  577-582
■653    ▼aDISSOLUTION▼aCU▼aSNBASES▼aSOLDERS▼aREFLOW▼aSLLDERING
■700    ▼aJong-Hyun  Lee,Dong-Hyuk  Shin,Yong-Seog  Kim
■773    ▼tMetals  and  Materials▼gVOL.9  NO.6  (2003  DECEMBER)▼d2003,  12
■SIS    ▼aS010509▼b60013551▼h8▼s2

미리보기

내보내기

chatGPT토론

Ai 추천 관련 도서