1
Kyung Taec KIM,
| 한국물리학회 |
2006
,
2
C. Kim,
| 한국물리학회 |
2007
,
3
Y. C. Kim,
| 한국물리학회 |
2007
,
5
Y. C. Kim,
| 한국물리학회 |
2006
,
6
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
J.H. Choy, K.L. Kavanagh, Y.C. Kim,
| 대한금속.재료학회 |
2004
,
7
K C Kim and M Y Lee,
| 대한용접학회 |
2001
,
8
Kimmy Wa Chan,
| American Marketing Association |
2010
,
9
Roger J. Calantone,
| American Marketing Association |
2000
,
10
Xun Yu,
| Institute of Electrical and Electronics Engineers |
2007
,
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