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351
Modeling and Motion Control of Mobile robot for Lattice Type Welding
Modeling and Motion Control of Mobile robot for Lattice Type Welding
Yang Bae Jeon, | 대한기계학회 | 2002 ,
352
Fatiaue Strength Assessment of Spot-Welded Lap Joint Using Strain Energy Density Factor
Fatiaue Strength Assessment of Spot-Welded Lap Joint Using Strain Energy Density Factor
Sohn Ilseon,Bae Dongho, | 대한기계학회 | 2001 ,
353
Development of the Fatigue Life Prediction Method for IB Type Single Spot-Weled Lap Joint by Maximum Stress Function
Development of the Fatigue Life Prediction Method for IB Type Single Spot-Weled Lap Joint by Maximum Stress Function
Sohn Ilseon,Bae Dongho, | 대한기계학회 | 2000 ,
354
Force Distribution of a Six-Legged Walking Robot with High Constant Speed
Force Distribution of a Six-Legged Walking Robot with High Constant Speed
Kwang Suk Jung,Yoon Su Baek, | 대한기계학회 | 2000 ,
355
Fatigue Crack Growth and Fracture Toughness Properties of 304 Stainless Steel Pipe For LNG Transmission
Fatigue Crack Growth and Fracture Toughness Properties of 304 Stainless Steel Pipe For LNG Transmission
Jong-Hyung Baek,Cheol-Man Kim,Woo-Sik Kim, | 대한금속.재료학회 | 2001 ,
356
The Ordering Behavior of supersaturated Metastable Phases in β-Ti Alloys
The Ordering Behavior of supersaturated Metastable Phases in β-Ti Alloys
Byung-Hak Baek,Cheol-Man Kim,Woo-Sik Kim, | 대한금속.재료학회 | 2001 ,
357
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
358
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Young Bae Park,Il Young Yoo, | 대한금속.재료학회 | 2001 ,
359
Synthesis of Ag/SiO₂Nanosize Particles by Reverse Micelle and Sol-Gel Processing
Synthesis of Ag/SiO₂Nanosize Particles by Reverse Micelle and Sol-Gel Processing
Dong-Sik bae,Sang-Whan Park,Kyong-Sop Han, | 대한금속.재료학회 | 2001 ,
360
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Young Bae Park,Duk Won Lee, | 대한금속.재료학회 | 2001 ,
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