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1
Stress and Stress Voiding in Cu/Low-k Interconnects
Stress and Stress Voiding in Cu/Low-k Interconnects
Jong-Min Paik, | 대한전자공학회 | 2003 ,
2
Synthesis, Structural Characterization, and Photoluminescence Properties of SiOχ Nanowires Prepared Using a Palladium Catalyst
Synthesis, Structural Characterization, and Photoluminescence Properties of SiOχ Nanowires Prepared Using a Palladium Catalyst
Hyoun Woo Kim, | 한국물리학회 | 2007 ,
3
Stress and Stress Induced Failure of Damascene Cu Interconnects
Stress and Stress Induced Failure of Damascene Cu Interconnects
Jong-Min Paik, | 대한금속재료학회 | 2005 ,
4
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Shin Bok Lee, Young Ran Yoo, Ja-Young Jung, Young, | 한국마이크로전자및 패키징학회 | 2005 ,
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