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1
텅스텐 플러그 CVD 공정에서 SIH4 Soak의 영향
텅스텐 플러그 CVD 공정에서 SIH4 Soak의 영향
이우선 ( Woo Sun Lee ), | 한국전기전자재료학회 | 2003 ,
2
반도체 : 탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성
반도체 : 탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성
서용진 ( Yong Jin Seo ), | 한국전기전자재료학회 | 2003 ,
3
Design and Fabrication of the 0.1 ㎛ Γ-Shaped Gate PHEMT
Design and Fabrication of the 0.1 ㎛ Γ-Shaped Gate PHEMT
Seong Dae Lee, | 한국전자파학회 | 2001 ,
4
Reduction of Plasma Process Induced Damage during HDP IMD Deposition
Reduction of Plasma Process Induced Damage during HDP IMD Deposition
Sang Yong Kim, | 한국전기전자재료학회 | 2003 ,
5
Polishing Mechanism of TEOS-CMP with High-temperature Slurry by Surface Analysis
Polishing Mechanism of TEOS-CMP with High-temperature Slurry by Surface Analysis
Nam Hoon Kim, | 한국전기전자재료학회 | 2005 ,
6
Liquid Crystal Alignment Effects on Nitrogen-doped Diamond like Carbon Layer by Ion Beam Alignment Method
Liquid Crystal Alignment Effects on Nitrogen-doped Diamond like Carbon Layer by Ion Beam Alignment Method
Jeong Min Han, | 한국전기전자재료학회 | 2008 ,
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