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1
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
3
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Koungsuk Kim, Kisoo Kang, Seungtack Jung, | 대한기계학회 | 2005 ,
4
Thermomechanical Stability of Memory Package with LOC Structure
Thermomechanical Stability of Memory Package with LOC Structure
Seong-Min Lee, | Metals and Materials | 2005 ,
5
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung, | Metals and Materials | 2005 ,
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