MARC

 008060420s2005        ULKa    a                          ENG
■022    ▼a1738494X
■245    ▼aNon-Destructive  Evaluation  of  Semiconductor  Package  by  Electronic  Speckle  Pattern  Interferometry▼dKoungsuk  Kim,  Kisoo  Kang,  Seungtack  Jung
■260    ▼a서울▼b대한기계학회▼c2005.
■300    ▼app.  820-825
■653    ▼aNONDESTRUCTIVE▼aEVALUATION▼aSEMICONDUCTOR▼aPACKAGE▼aELECTRONIC▼aSPECKLE▼aPATTERN▼aINTERFEROMETRY
■700    ▼aKoungsuk  Kim,  Kisoo  Kang,  Seungtack  Jung
■773    ▼tJournal  of  Mechanical  Science  and  Technology▼gVol.  19  (No.  3)▼d2005,  03
■URL    ▼ahttp://www.ksme.or.kr
■SIS    ▼aS017618▼b60064619▼h8▼s2

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