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3 Results:SS:ELECTROMIGRATION 0.171 sec.
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1
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
2
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Young Bae Park,Duk Won Lee, | 대한금속.재료학회 | 2001 ,
3
Electromigration에 의한 Near-Bamboo 배선의 파손
Electromigration에 의한 Near-Bamboo 배선의 파손
박영준, | 대한금속.재료학회 | 2001 ,
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