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1
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Young Bae Park,Il Young Yoo, | 대한금속.재료학회 | 2001 ,
2
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Young Bae Park,Duk Won Lee, | 대한금속.재료학회 | 2001 ,
3
Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Effects of Electroplated Cu Thickness and Plymide Plasma Treatment Conditions on the Interfacial Fracture Mechanics Parameters in the Cu/Cr/Plyimide System
Young Bae Park,Jin Yu, | 대한금속.재료학회 | 2001 ,
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