본문

  1. Home
1000 Results:AA:D B LEE 0.312 sec.
RSS 
다국어입력
 상세검색
 신착검색
선택출력 선택엑셀내보내기
941
Joint Development for KSTAR CS Coil
Joint Development for KSTAR CS Coil
K. Park, | 한국물리학회 | 2006 ,
942
Mechanical Test of Stacked 4×4 CICC for the KSTAR Central Solenoid
Mechanical Test of Stacked 4×4 CICC for the KSTAR Central Solenoid
H. K. Kim, | 한국물리학회 | 2006 ,
943
Curret Status of the KSTAR TF Superconducting Magnet Development
Curret Status of the KSTAR TF Superconducting Magnet Development
B. S. Lim, | 한국물리학회 | 2006 ,
944
Effective Area Calibration and Dynamic Characteristic Measurements of KSTAR Magnetic Field Probes
Effective Area Calibration and Dynamic Characteristic Measurements of KSTAR Magnetic Field Probes
S. G. Lee, | 한국물리학회 | 2006 ,
945
First Results of the Kinetic Stabilizer in the Habit Tandem Mirror
First Results of the Kinetic Stabilizer in the Habit Tandem Mirror
A. C. England, | 한국물리학회 | 2006 ,
946
Beam Comvination Using Stimulatd Brillouin Scattering Phase Conjugate Mirror for Laser Fusion Driver
Beam Comvination Using Stimulatd Brillouin Scattering Phase Conjugate Mirror for Laser Fusion Driver
Hong Jin Kong, | 한국물리학회 | 2006 ,
947
Nickel-Based Germanosilicide of n+-Si0.83Ge0.17For Various Doping Concentrations and Rapid Thermal Annealing Conditions
Nickel-Based Germanosilicide of n+-Si0.83Ge0.17For Various Doping Concentrations and Rapid Thermal Annealing Conditions
A. R. Choi, | 한국물리학회 | 2007 ,
948
Characterization and Improvement of Reverse Leakage Current of Shallow Silicided Junction for Sub-100 nm CMOS TEchnology Utilizing N₂PAI
Characterization and Improvement of Reverse Leakage Current of Shallow Silicided Junction for Sub-100 nm CMOS TEchnology Utilizing N₂PAI
Kyong-Jin Hwang, | 한국물리학회 | 2007 ,
949
Negative Differential Transconductance Characteristics and Inter-Band Tunneling Mechanism of Fabricated FITETs
Negative Differential Transconductance Characteristics and Inter-Band Tunneling Mechanism of Fabricated FITETs
Seung-Hwan Song, | 한국물리학회 | 2007 ,
950
Thermal Stability and Adhesion Improvement of Cu(Ag)/Mo Bilayer Metallization in Large-Area TFT-LCDs
Thermal Stability and Adhesion Improvement of Cu(Ag)/Mo Bilayer Metallization in Large-Area TFT-LCDs
H. M. Lee, | 한국물리학회 | 2007 ,
처음이전90919293949596979899이후마지막