본문

  1. Home
843 Results:SS:PA 0.292 sec.
RSS 
Multilingual
 Erweiterte Suche
 Neuankömmling Buch suchen
ausgewählten Druck Select Export to Excel
761
PAS Consolidating Behavior of Mechanically Alloyed Nanocrystalline NiAl Intermetallic Compound
PAS Consolidating Behavior of Mechanically Alloyed Nanocrystalline NiAl Intermetallic Compound
Jae Woong Choi,Sung Goon Kang, | 대한금속.재료학회 | 2003 ,
762
Effect of Interfacial Segregationon Phase Decomposition of a Thin Film on a Patterned Substrate
Effect of Interfacial Segregationon Phase Decomposition of a Thin Film on a Patterned Substrate
William C.Johnson,S.M.Wise,J.Y.Huh, | 대한금속.재료학회 | 2003 ,
763
Dependences of the Reflectivity and Adhension of Thin Metal Films on the Various Process Parameters for Polyester Substrates During Physical Vapor Depositions
Dependences of the Reflectivity and Adhension of Thin Metal Films on the Various Process Parameters for Polyester Substrates During Physical Vapor Depositions
EuiJae RI, | 대한금속.재료학회 | 2002 ,
764
Effects of Cold Rolling Parameters on Sagging Behavior For Three Layer Al-Si/Al-Mn(Zn)/Al-Si Brazing Sheets
Effects of Cold Rolling Parameters on Sagging Behavior For Three Layer Al-Si/Al-Mn(Zn)/Al-Si Brazing Sheets
S.H.Lee,J.S.Yoon,M.S.Kim, | 대한금속.재료학회 | 2002 ,
765
Corrosion Resistance of Fe₂O₃-Cr₂O₃Artificial Passive Films Formed with LP-MOCVD
Corrosion Resistance of Fe₂O₃-Cr₂O₃Artificial Passive Films Formed with LP-MOCVD
Hyun-Soo Kim,Jae-Hong Yoon,Kee-Sam Shin, | 대한금속.재료학회 | 2002 ,
766
A New Approach to Predicting Partial Recrystallization in the Multi-Pass Hot Rolling Process
A New Approach to Predicting Partial Recrystallization in the Multi-Pass Hot Rolling Process
Sangwoo Choi,Youngseog Lee, | 대한금속.재료학회 | 2002 ,
767
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
768
A New Low Carbon Steel Microstructure: Ultrafine Ferrite Grains with Homogeneously Distributed Fine Cementite Particles
A New Low Carbon Steel Microstructure: Ultrafine Ferrite Grains with Homogeneously Distributed Fine Cementite Particles
Dong Hyuk Shin,Jongryoul Kim,Kyung-Tae Park, | 대한금속.재료학회 | 2001 ,
769
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Pattern Density and Pitch Effects on Chemical-Mechanical Polishing
Young Bae Park,Il Young Yoo, | 대한금속.재료학회 | 2001 ,
770
Synthesis of Ag/SiO₂Nanosize Particles by Reverse Micelle and Sol-Gel Processing
Synthesis of Ag/SiO₂Nanosize Particles by Reverse Micelle and Sol-Gel Processing
Dong-Sik bae,Sang-Whan Park,Kyong-Sop Han, | 대한금속.재료학회 | 2001 ,
처음이전72737475767778798081이후마지막
1
AAO-HNSF Patient of the Month Program
B.C. Decker Inc. [, ]
2
Acta Orthopaedica
Taylor & Francis Ltd [, ]
3
Acta Orthopaedica
Taylor & Francis Ltd [, ]
4
Acta Orthopaedica Scandinavica
Taylor & Francis Ltd [, ]
5
Acta Orthopaedica Scandinavica
Taylor & Francis Ltd [, ]
6
Acta Orthopaedica (Supplement)
Taylor & Francis Ltd [, ]
7
Acta Orthopaedica (Supplement)
Taylor & Francis Ltd [, ]
8
Acta Paediatrica
Taylor & Francis Ltd [, ]
9
Acta Paediatrica. Supplement
Taylor & Francis Ltd [, ]
10
Active & Passive Electronic Components
Taylor & Francis Ltd [, ]
11
Acts Passed by the General Assembly of Louisiana, 1865
Great Neck Publishing [, ]
12
Addiction Biology
Carfax Publishing Company [, ]
13
Adult Literacy
US Department of Education [, ]
14
Adultspan: Theory Research & Practice
American Counseling Association [, ]
15
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
16
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
17
Advanced Packaging
Penn Well Publishing Co. [, ]
18
Advanced Placement (AP) Examinations
US Department of Education [, ]
19
Advances in Complex Systems
World Scientific Publishing Company [, ]
20
Advances in Speech Language Pathology
Taylor & Francis Ltd [, ]