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51
반도체 : 탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성
반도체 : 탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성
서용진 ( Yong Jin Seo ), | 한국전기전자재료학회 | 2003 ,
52
지중 배전케이블의 열화에 미치는 온수의 영향
지중 배전케이블의 열화에 미치는 온수의 영향
한재홍(Jae Hong Han), | 한국전기전자재료학회 | 2002 ,
53
Design and Fabrication of the 0.1 ㎛ Γ-Shaped Gate PHEMT
Design and Fabrication of the 0.1 ㎛ Γ-Shaped Gate PHEMT
Seong Dae Lee, | 한국전자파학회 | 2001 ,
54
Selection and Characterization of Transposon Tagging Mutants of Synechocystis sp. PCC 6803 Sensitive to High-Light and Oxidative Stresses
Selection and Characterization of Transposon Tagging Mutants of Synechocystis sp. PCC 6803 Sensitive to High-Light and Oxidative Stresses
Eun Kyeong Song, | 한국식물학회(Adventitous Root Formation | 2004 ,
55
Ultrastructural Changes of Cell Organelles in Arabidopsis Stems after Gamma Irradation
Ultrastructural Changes of Cell Organelles in Arabidopsis Stems after Gamma Irradation
Seung Gon Wi, | 한국식물학회(Adventitous Root Formation | 2005 ,
56
Thermal Stability and Electrical Properties of HfOxNy, Gate Dielectrics with TaN Gate Electrode
Thermal Stability and Electrical Properties of HfOxNy, Gate Dielectrics with TaN Gate Electrode
Jeon Ho Kim, | 한국전기전자재료학회 | 2004 ,
57
Reduction of Plasma Process Induced Damage during HDP IMD Deposition
Reduction of Plasma Process Induced Damage during HDP IMD Deposition
Sang Yong Kim, | 한국전기전자재료학회 | 2003 ,
58
Regular Paper : A New SOI LIGBT Structure with Improved Latch - Up Performance
Regular Paper : A New SOI LIGBT Structure with Improved Latch - Up Performance
Woong Je Sung, | 한국전기전자재료학회 | 2002 ,
59
Polishing Mechanism of TEOS-CMP with High-temperature Slurry by Surface Analysis
Polishing Mechanism of TEOS-CMP with High-temperature Slurry by Surface Analysis
Nam Hoon Kim, | 한국전기전자재료학회 | 2005 ,
60
Improvement of Hybrid EL Efficiency in Nanoparticle EL Devices by Insertion of the Layers of PVK and BaF2
Improvement of Hybrid EL Efficiency in Nanoparticle EL Devices by Insertion of the Layers of PVK and BaF2
Jun Woo Lee, | 한국전기전자재료학회 | 2005 ,
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