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541
Effect of Interfacial Segregationon Phase Decomposition of a Thin Film on a Patterned Substrate
Effect of Interfacial Segregationon Phase Decomposition of a Thin Film on a Patterned Substrate
William C.Johnson,S.M.Wise,J.Y.Huh, | 대한금속.재료학회 | 2003 ,
542
Investigation of Interface Reaction Between TiAl Alloys and Mold Materials
Investigation of Interface Reaction Between TiAl Alloys and Mold Materials
Myoung-Hyun Kim,Young-Jig Kim, | 대한금속.재료학회 | 2002 ,
543
Evaluation of Ni Film Interfacial Energy Release Rate on Titanium and Stainless Steel Substrates
Evaluation of Ni Film Interfacial Energy Release Rate on Titanium and Stainless Steel Substrates
F.Z.Ren,W.Z.Zhao,G.S.Zhou, | 대한금속.재료학회 | 2002 ,
544
Experimental Determination of Interfacial Toughness CUrves
Experimental Determination of Interfacial Toughness CUrves
Ho-Youn Lee, | 대한금속.재료학회 | 2002 ,
545
How to interpret handwriting
How to interpret handwriting
Desenclos, Hubert, 747.2-D451h-안진홍 | Crescent Books | 1995 747.2-D451h-안진홍,
546
Tunable characteristics of (Ba0.5Sr0.5)TiO₃(BST) Capacitors Using (Ba0.5Sr0.5)RuO₃(BSR) Interfacial Layers onto Pt/Ti/SiO₂/Si Substrates
Tunable characteristics of (Ba0.5Sr0.5)TiO₃(BST) Capacitors Using (Ba0.5Sr0.5)RuO₃(BSR) Interfacial Layers onto Pt/Ti/SiO₂/Si Substrates
Tae-Suck Seo,Young-Ah Jeon,Soon-Gil Yoon, | 대한금속.재료학회 | 2001 ,
547
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
548
Influence of Electron Beam Welding Parameters and Metallugical Factors on Intergranular Liquation Cracking Susceptibility of Cast Alloy 718
Influence of Electron Beam Welding Parameters and Metallugical Factors on Intergranular Liquation Cracking Susceptibility of Cast Alloy 718
Insu Woo,Chungyun Kang,Kazutoshi Nishimoto, | 대한금속.재료학회 | 2001 ,
549
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Young Bae Park,Duk Won Lee, | 대한금속.재료학회 | 2001 ,
550
Synthesis of YBa₂Cu₃Oy Superconductors via Attriton-Milled Intermediate Oxide Precursor Containing BaCuO2.5
Synthesis of YBa₂Cu₃Oy Superconductors via Attriton-Milled Intermediate Oxide Precursor Containing BaCuO2.5
Haiwoong Park,Haigun Lee, | 대한금속.재료학회 | 2001 ,
처음이전50515253545556575859이후마지막
1
1st International Conference
이화여자대학교 국제통상협력연구소 [경제학, ]
2
2000 International Congress on Exercise Nutrition
한국운동영양학회 [생활과학, ]
3
2004 The Costume Culture Association International Conference
복식문화학회 [생활과학, ]
4
2009 International Workshop
전남대학교 아시아태평양지역연구소 [사회과학, ]
5
98 International symposium
한국환경농학회 [농업·농학, ]
6
Acoustical Physics
MAIK Nauka Interperiodica [, ]
7
Advanced Composite Materials
VSP International Science Publishers [, ]
8
Advanced Materials & Processes
ASM International [, ]
9
Advanced Powder Technology
VSP International Science Publishers [, ]
10
Advanced Robotics
VSP International Science Publishers [, ]
11
Advancing the Consumer Interest
American Council on Consumer Interests [, ]
12
Ageing International
Transaction Publishers [, ]
13
Agenda Internacional
Pontificia Universidad Catolica del Peru [, ]
14
Agricultural Engineering International: CIGR Journal
International Commission of Agricultural Engineering [, ]
15
Alternatives: Turkish Journal of International Relations
Department of International Relations at Fatih University [, ]
16
American Foreign Policy Interests
Taylor & Francis Ltd [, ]
17
American History
Primedia Special Interest Publications [, ]
18
American History Illustrated
Primedia Special Interest Publications [, ]
19
American Studies International
American Studies International [, ]
20
America's Civil War
Primedia Special Interest Publications [, ]