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21
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
22
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
23
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Ji Hyuck Yang, Kang Yong Lee, C. Y. Dong, | 대한기계학회 | 2004 ,
24
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Myong-Soo Chung, Sang-Hyun Lee, Young-Sun You, Hy, | Korean Societyof Food Science&Technology | 2006 ,
25
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Jong Nam Park, Jang Hyn Kyoung, Wie Soo Kang, Che, | 한국원예학회 | 2006 ,
26
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Jong Nam Park, Jang Hun Kyoung, Cheon Soon Jeong, | 한국원예학회 | 2006 ,
27
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Koungsuk Kim, Kisoo Kang, Seungtack Jung, | 대한기계학회 | 2005 ,
28
Rectangle Packing 방식 기반 NoC 테스트 스케쥴링
Rectangle Packing 방식 기반 NoC 테스트 스케쥴링
안진호, 김근배, 강성호, | 대한전자공학회 | 2006 ,
29
Reassessment of Japan's Official Development Aid to Asia Pacific Developing Nations at the Start of the 21 Century
Reassessment of Japan's Official Development Aid to Asia Pacific Developing Nations at the Start of the 21 Century
Eugenii B. Kourigin, | Korea Trade Research Association Inc. | 2002 ,
30
Effect of Packing Size on Chomatographic Separation of Cetechin Compounds in Green Tea
Effect of Packing Size on Chomatographic Separation of Cetechin Compounds in Green Tea
Ji Hoon Kang, Seung Bum Hong, Jung Il Kim, Sung T, | 한국화학공학회 | 2000 ,
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1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Aerospace Power Journal
Superintendent of Documents [, ]
5
Air & Space Power Journal
Superintendent of Documents [, ]
6
Asian Perspectives: Journal of Archeology for Asia & the Pacific
University of Hawaii Press [, ]
7
Asia-Pacific Conference on Communications
한국통신학회 [공학, ]
8
Asia-Pacific Conference on Communications
한국통신학회 [, ]
9
Asia Pacific Family Medicine
Blackwell Publishing Limited [, ]
10
AsiaPacific Issues
East-West Center [, ]
11
Asia-Pacific Journal of Atmospheric Sciences
한국기상학회 [자연과학, ]
12
Asia-Pacific Journal of Atmospheric Sciences
한국기상학회 [, ]
13
Asia-Pacific Journal of Business & Commerce
전북대학교 산업경제연구소 [경제·경영, ]
14
Asia-Pacific Journal of Business & Commerce 아태경상저널
전북대학교 산업경제연구소 [, ]
15
Asia-Pacific Journal of EU Studies
한국EU학회 [경제학, ]
16
Asia-Pacific Journal of Intellectual Disabilities (APJID)
대구대학교 한국특수교육문제연구소 [교육학, ]
17
Asia-Pacific Journal of Marine Science & Education
Asia-Pacific Journal of Marine Science & Education [, ]
18
Asia-Pacific journal of research in early childhood education
환태평양유아교육연구학회 [, ]
19
Asia-Pacific journal of research in early childhood education
환태평양유아교육연구학회 [유아교육학, ]
20
Asia-Pacific Journal of Teacher Education
Carfax Publishing Company [, ]