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11
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Myung Jin Yim, | 대한금속재료학회 | 2006 ,
12
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
K. W. Lee, | 대한금속재료학회 | 2006 ,
13
반도체 Package 공정용 emc gun에 관한 연구
반도체 Package 공정용 emc gun에 관한 연구
조명현, | 대한전자공학회 | 2006 ,
14
PACAD/EMTDC을 이용한 유도기 부하를 고려한 DSTATCOM의 보상제어에 관한 연구
PACAD/EMTDC을 이용한 유도기 부하를 고려한 DSTATCOM의 보상제어에 관한 연구
이명언, | 대한전자공학회 | 2006 ,
15
Adaptive Cross-Layer Packet Scheduling Method for Multimedia Services in Wireless Personal Area Networks
Adaptive Cross-Layer Packet Scheduling Method for Multimedia Services in Wireless Personal Area Networks
Kim, SungWon, | 한국통신학회 | 2006 ,
16
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Youn-Chul Ryu, Min-Suk Rhee, Moo-Ha Lee, Sung-Ki, | Korean Societyof Food Science&Technology | 2006 ,
17
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
18
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
19
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Ji Hyuck Yang, Kang Yong Lee, C. Y. Dong, | 대한기계학회 | 2004 ,
20
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Myong-Soo Chung, Sang-Hyun Lee, Young-Sun You, Hy, | Korean Societyof Food Science&Technology | 2006 ,
처음이전12345이후마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Aerospace Power Journal
Superintendent of Documents [, ]
5
Air & Space Power Journal
Superintendent of Documents [, ]
6
Asian Perspectives: Journal of Archeology for Asia & the Pacific
University of Hawaii Press [, ]
7
Asia-Pacific Conference on Communications
한국통신학회 [공학, ]
8
Asia-Pacific Conference on Communications
한국통신학회 [, ]
9
Asia Pacific Family Medicine
Blackwell Publishing Limited [, ]
10
AsiaPacific Issues
East-West Center [, ]
11
Asia-Pacific Journal of Atmospheric Sciences
한국기상학회 [자연과학, ]
12
Asia-Pacific Journal of Atmospheric Sciences
한국기상학회 [, ]
13
Asia-Pacific Journal of Business & Commerce
전북대학교 산업경제연구소 [경제·경영, ]
14
Asia-Pacific Journal of Business & Commerce 아태경상저널
전북대학교 산업경제연구소 [, ]
15
Asia-Pacific Journal of EU Studies
한국EU학회 [경제학, ]
16
Asia-Pacific Journal of Intellectual Disabilities (APJID)
대구대학교 한국특수교육문제연구소 [교육학, ]
17
Asia-Pacific Journal of Marine Science & Education
Asia-Pacific Journal of Marine Science & Education [, ]
18
Asia-Pacific journal of research in early childhood education
환태평양유아교육연구학회 [, ]
19
Asia-Pacific journal of research in early childhood education
환태평양유아교육연구학회 [유아교육학, ]
20
Asia-Pacific Journal of Teacher Education
Carfax Publishing Company [, ]