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Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Detailed Information
- 자료유형
- 기사
- ISSN
- 17388090
- 저자명
- Myung Jin Yim
- 서명/저자
- Review of Electrically Conductive Adhesive Technologies for Electronic Packaging / Myung Jin Yim , Kyung Wook Paik
- 발행사항
- 서울 : 대한금속재료학회, 2006.
- 형태사항
- pp. 183-194
- 기타저자
- Kyung Wook Paik
- 모체레코드
- 모체정보확인
- Control Number
- kjul:60092625
MARC
008070309s2006 ULKa a ENG■022 ▼a17388090
■1001 ▼aMyung Jin Yim
■245 ▼aReview of Electrically Conductive Adhesive Technologies for Electronic Packaging▼dMyung Jin Yim▼eKyung Wook Paik
■260 ▼a서울▼b대한금속재료학회▼c2006.
■300 ▼app. 183-194
■653 ▼aREVIEW▼aELECTRICALLY▼aCONDUCTIVE▼aADHESIVE▼aTECHNOLOGIES▼aELECTRONIC▼aPACKAGING
■7001 ▼aKyung Wook Paik
■773 ▼tELECTRONIC MATERIALS Letters▼gVol. 2 No. 3▼d2006, 12
■SIS ▼aS037322▼b60077032▼h8▼s2
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