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11
논문 : 반도체 ; 실리카 연마제가 첨가된 재활용 슬러리를 사용한 2단계 CMP 특성
논문 : 반도체 ; 실리카 연마제가 첨가된 재활용 슬러리를 사용한 2단계 CMP 특성
서용진 ( Seo Yong Jin ), | 한국전기전자재료학회 | 2003 ,
12
실리카 슬러리의 에이징 효과 및 산화막 CMP 특성
실리카 슬러리의 에이징 효과 및 산화막 CMP 특성
이우선 ( Lee U Seon ), | 한국전기전자재료학회 | 2004 ,
13
금속 CMP 적용을 위한 산화제의 역할
금속 CMP 적용을 위한 산화제의 역할
서용진 ( Seo Yong Jin ), | 한국전기전자재료학회 | 2004 ,
14
Stability of H2O2 as an Oxidizer for Cu CMP
Stability of H2O2 as an Oxidizer for Cu CMP
Do Won Lee, | 한국전기전자재료학회 | 2005 ,
15
Dishing and Erosion Evaluations of Tungsten CMP Slurry in the Orbital Polishing System
Dishing and Erosion Evaluations of Tungsten CMP Slurry in the Orbital Polishing System
Sang Ho Lee, | 한국전기전자재료학회 | 2007 ,
16
Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System
Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System
Hyosang Lee, | 한국전기전자재료학회 | 2008 ,
17
Effect of Channel Length in LDMOSFET on the Switching Characteristic of CMOS Inverter
Effect of Channel Length in LDMOSFET on the Switching Characteristic of CMOS Inverter
Zhi Yuan Cui, | 한국전기전자재료학회 | 2008 ,
18
Diamond Conditioner Wear Characterization for a Copper CMP Process
Diamond Conditioner Wear Characterization for a Copper CMP Process
L. Boruckia, | 한국전기전자재료학회 | 2008 ,
19
Study of Inhibition Characteristics of Slurry Additives in Copper CMP using Force Spectroscopy
Study of Inhibition Characteristics of Slurry Additives in Copper CMP using Force Spectroscopy
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
20
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
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