본문

  1. Home
11 Results:SS:PACKAGE 0.140 sec.
RSS 
다국어입력
 상세검색
 신착검색
선택출력 선택엑셀내보내기
1
Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Using a Corrugated Bridge with HRS MEMS Package
Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Using a Corrugated Bridge with HRS MEMS Package
Yo-Tak Song., | 한국전자파학회 | 2006 ,
2
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
Myung Jin Vim, | 대한금속재료학회 | 2006 ,
3
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
K. W. Lee, | 대한금속재료학회 | 2006 ,
4
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Application of the Axiomatic Design Methodology to the Design of PBGA Package with Polyimide Coating Layer
Ji Hyuck Yang, Kang Yong Lee, C. Y. Dong, | 대한기계학회 | 2004 ,
5
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Koungsuk Kim, Kisoo Kang, Seungtack Jung, | 대한기계학회 | 2005 ,
6
Thermomechanical Stability of Memory Package with LOC Structure
Thermomechanical Stability of Memory Package with LOC Structure
Seong-Min Lee, | Metals and Materials | 2005 ,
7
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung, | Metals and Materials | 2005 ,
8
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Seong-Min Lee, | 대한금속.재료학회 | 2003 ,
9
Evaluation of Thermal Deformation in Electronic Packages
Evaluation of Thermal Deformation in Electronic Packages
Hyeon Gyu Beom, | 대한기계학회 | 2000 ,
10
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
처음12이후마지막