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1
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Tae Kyu Lee, | 대한금속재료학회 | 2006 ,
2
Accurate Extraction of Crosstalk Induced Dynamic Variation of Coupling Capacitance for Interconnect Lines of CMOSFETs
Accurate Extraction of Crosstalk Induced Dynamic Variation of Coupling Capacitance for Interconnect Lines of CMOSFETs
Yong Goo-Kim, Hee-Hwan Ji, Hyung Sun Yoon, Sung H, | 대한전자공학회 | 2004 ,
3
Decentralized Control for Multimachine Power Systems with Nolinear interconnections and Disturbances
Decentralized Control for Multimachine Power Systems with Nolinear interconnections and Disturbances
Kyu-Il Jung, Kwang-Youn Kim, Tae-Woong Yoon, Gils, | The Korean Institute of Electrical Eng. | 2005 ,
4
Design of Robust Hoo Control for Interconnected Systems : A Homotopy Method
Design of Robust Hoo Control for Interconnected Systems : A Homotopy Method
Ning Chen, Masao Ikeda, Weihua Gui, | The Korean Institute of Electrical Eng. | 2005 ,
5
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
6
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Young Bae Park,Duk Won Lee, | 대한금속.재료학회 | 2001 ,
7
Multilevel Interconnect Technology
Multilevel Interconnect Technology
Rao, Gopal K, 004.73-R215m | McGraw-Hill | 1993 004.73-R215m,
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1
Journal of Interconnection Networks
World Scientific Publishing Company [, ]