본문

  1. Home
5 Results:SS:ELECTROMIGRATION 0.48 sec.
RSS 
Multilingual
 Расширенный поиск
 Новый поиск книги прибытия
Selected Print Select Export to Excel
1
Electromigration Behaviors of SnAgCu Solder Lines
Electromigration Behaviors of SnAgCu Solder Lines
Min Seung Yoon, | 대한금속재료학회 | 2006 ,
2
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Tae Kyu Lee, | 대한금속재료학회 | 2006 ,
3
A Phase Field Model For Electromigration-Induced Surface Evolution
A Phase Field Model For Electromigration-Induced Surface Evolution
Ji-Hee Kim,Pill-Ryung Cha,Dong-Hee Yeon, | 대한금속.재료학회 | 2003 ,
4
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
5
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Effects of Texture ans Grain Structure on Electromigration Lifetime of Al-Cu Interconnects
Young Bae Park,Duk Won Lee, | 대한금속.재료학회 | 2001 ,
처음1마지막