1
Y. C. Kim,
| 한국물리학회 |
2007
,
2
Y. C. Kim,
| 한국물리학회 |
2006
,
3
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
J.H. Choy, K.L. Kavanagh, Y.C. Kim,
| 대한금속.재료학회 |
2004
,
4
Kimmy Wa Chan,
| American Marketing Association |
2010
,
5
Xun Yu,
| Institute of Electrical and Electronics Engineers |
2007
,
6
Seung-Hi Lee,
| Institute of Electrical and Electronics Engineers |
2004
,
7
Dong-Ho Shin,
| Institute of Electrical and Electronics Engineers |
2004
,
8
Young-Hoon Kim,
| Institute of Electrical and Electronics Engineers |
2004
,
9
Yang-O Kim,
| Institute of Electrical and Electronics Engineers |
2003
,
10
Ki-Seok Kim,
| Institute of Electrical and Electronics Engineers |
2003
,
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