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1
Call Papers for March 2005 Special Issue on Microtransducer Technologies
Call Papers for March 2005 Special Issue on Microtransducer Technologies
, | 대한전자공학회 | 2004 ,
2
Optimization of InA1As/InGaAs HEMT Performance for Microwave Frequency Applications and Reliability
Optimization of InA1As/InGaAs HEMT Performance for Microwave Frequency Applications and Reliability
Ritesh Gupta, | 대한전자공학회 | 2004 ,
3
Optimization of Gate Stack MOSFETs with Quantization Effect
Optimization of Gate Stack MOSFETs with Quantization Effect
Tina Mangla, | 대한전자공학회 | 2004 ,
4
Cell Signal Distribution Characteristics For High Density FeRAM
Cell Signal Distribution Characteristics For High Density FeRAM
Hee-Bok Kang, | 대한전자공학회 | 2004 ,
5
High-Rate Laser Ablation For Through -Wafer Via Holes in SiC Substrates and GaN/AIN/SiC Templates
High-Rate Laser Ablation For Through -Wafer Via Holes in SiC Substrates and GaN/AIN/SiC Templates
S. Kim, | 대한전자공학회 | 2004 ,
6
A Noncoherent UWB Communication System for Low Power Applications
A Noncoherent UWB Communication System for Low Power Applications
Suckchel Yang, | 대한전자공학회 | 2004 ,
7
Partial Matched Filter for Low Power and Fast Code Acquisition of DSSS-CPFSK Signals
Partial Matched Filter for Low Power and Fast Code Acquisition of DSSS-CPFSK Signals
Hyung Chul Park, | 대한전자공학회 | 2004 ,
8
Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals
Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals
R.J. Gutmann, | 대한전자공학회 | 2004 ,
9
A Wafer Level Packaged Limiting Amplifier for 10Gbps Optical Transmission System
A Wafer Level Packaged Limiting Amplifier for 10Gbps Optical Transmission System
Chul-Won Ju, | 대한전자공학회 | 2004 ,
10
A System-in-package (SiP) Integration of a 62GHz Transmitter for MM-wave Communication Terminals Applications
A System-in-package (SiP) Integration of a 62GHz Transmitter for MM-wave Communication Terminals Applications
Young Chul Lee, | 대한전자공학회 | 2004 ,
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