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1
Fabrication of Nanostructured Films of Block Copolymers for Nanolithographical Masks
Fabrication of Nanostructured Films of Block Copolymers for Nanolithographical Masks
Dae-Ho Park, Byeong-Hyeok Sohn, Jin Chul Jung, W, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Broadband 180º Bit X-band Phase Shifter Using Parallel-Coupled Lines
Broadband 180º Bit X-band Phase Shifter Using Parallel-Coupled Lines
Gyu-Je Sung, Hyun-Sik Park, Dong-Yon Kim, | 한국마이크로전자및 패키징학회 | 2005 ,
3
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Shin Bok Lee, Young Ran Yoo, Ja-Young Jung, Young, | 한국마이크로전자및 패키징학회 | 2005 ,
4
Preparation and Crystallization Kinetics of Glasses with Ferroelectric Fresnoite Crystal
Preparation and Crystallization Kinetics of Glasses with Ferroelectric Fresnoite Crystal
Hoi Kwan Lee, Su Jin Chae, Won Ho Kang, | 한국마이크로전자및 패키징학회 | 2005 ,
5
The Electrical and Optical Properties of Polymer Light Emitting Diode with ITO/PEDOT : PSS/MEH-PPV/AI Structure at Various Concentration of MEH-PPV
The Electrical and Optical Properties of Polymer Light Emitting Diode with ITO/PEDOT : PSS/MEH-PPV/AI Structure at Various Concentration of MEH-PPV
Su Cheol Gong, In Jea Back, Jae Hyouk Yoo, Hun Se, | 한국마이크로전자및 패키징학회 | 2005 ,
6
Characteristics of Ni/Co Composite Silicides for Poly-silicon Gates
Characteristics of Ni/Co Composite Silicides for Poly-silicon Gates
Sangyeob Kim, Youngsoon Jung, Ohsung Song, | 한국마이크로전자및 패키징학회 | 2005 ,
7
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
Tae-Hwan Cho, Seong-Jin Park, | 한국마이크로전자및 패키징학회 | 2005 ,
8
Effects of Temperature Amplitude an Loading Frequency on Alternating Current-Induced Damage in Cu Thin Films
Effects of Temperature Amplitude an Loading Frequency on Alternating Current-Induced Damage in Cu Thin Films
Young-Bae Park, | 한국마이크로전자및 패키징학회 | 2005 ,
9
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
J. S. Bae, G. H. Chang, J. H. Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
10
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Joo Won Lee, Sung K. Kang, Hyuck Mo Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
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