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1
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Joo Won Lee, Sung K. Kang, Hyuck Mo Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Jong-Hyun Lee,Dong-Hyuk Shin,Yong-Seog Kim, | 대한금속.재료학회 | 2003 ,
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