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1
Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film
Effect of particle size of ceria coated silica and polishing pressure on chemical mechanical polishing of oxide film
Kim, Hwan-Chul, | 한국전기전자재료학회 | 2007 ,
2
Effects of Polymer Adsorption on Stabilities and CMP Performance of Ceria Abrasive Particles
Effects of Polymer Adsorption on Stabilities and CMP Performance of Ceria Abrasive Particles
Norifumi Shimono, | 한국전기전자재료학회 | 2006 ,
3
Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing
Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing
Cho Kyu-Chul, | 한국재료학회 | 2006 ,
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