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5 Results:AA:NAM HOON KIM SANG YONG KIM EUI GOO CHANG 0.406 sec.
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1
반도체 : 금속 CMP 공정시 경질 다공성 패드의 적용
반도체 : 금속 CMP 공정시 경질 다공성 패드의 적용
김상용 ( Sang Yong Kim ), | 한국전기전자재료학회 | 2003 ,
2
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Tae Gun Kim, | 한국전기전자재료학회 | 2005 ,
3
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
4
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
5
Stability of H2O2 as an Oxidizer for Cu CMP
Stability of H2O2 as an Oxidizer for Cu CMP
Do Won Lee, | 한국전기전자재료학회 | 2005 ,
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