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1
Characteristics of Cobalt Films Deposited by Using a Remote Plasma ALD Method with a CpCo(Co)₂ Precursor
Characteristics of Cobalt Films Deposited by Using a Remote Plasma ALD Method with a CpCo(Co)₂ Precursor
Keunwoo Lee, | 한국물리학회 | 2007 ,
2
Characteristics of the Post-Etch Polymer Residues Formed at the Via Hole and Polymer Removal Using a Semi-Aqueous Stripper
Characteristics of the Post-Etch Polymer Residues Formed at the Via Hole and Polymer Removal Using a Semi-Aqueous Stripper
Sung Bea Kim, | 한국물리학회 | 2006 ,
3
Effect of the Hydroxy1-Ethy1-Cellulose Concentration in a silicon Wafer Polishing Slurry on the Wafer Surface Roughness
Effect of the Hydroxy1-Ethy1-Cellulose Concentration in a silicon Wafer Polishing Slurry on the Wafer Surface Roughness
Kyu-Chul Cho, | 한국물리학회 | 2006 ,
4
Characteristics of Al2O3 Thin Films Deposited Using Dimethyalluminum Isopropoxide and Trimethylaluminum Precursors by the Plasma-Enhanced Atomic-Layer Deposition Method
Characteristics of Al2O3 Thin Films Deposited Using Dimethyalluminum Isopropoxide and Trimethylaluminum Precursors by the Plasma-Enhanced Atomic-Layer Deposition Method
Jaehyoung Koo, | 한국물리학회 | 2006 ,
5
Effect of the Hydroxyl-Ethyl-Cellulose Concentration in a Silicon Wafer Polishing Slurry on the Wafer Surface Roughness
Effect of the Hydroxyl-Ethyl-Cellulose Concentration in a Silicon Wafer Polishing Slurry on the Wafer Surface Roughness
Cho, Kyu-chul, | 한국물리학회 | 2006 ,
6
Characteristics of Al₂O₃ Thin Films Deposited Using Dimethylaluminum Isopropoxide and Trimethylaluminum Precursors by the Plasma-Enhanced Atomic-Layer Deposition Method
Characteristics of Al₂O₃ Thin Films Deposited Using Dimethylaluminum Isopropoxide and Trimethylaluminum Precursors by the Plasma-Enhanced Atomic-Layer Deposition Method
Koo, Jaehyoung, | 한국물리학회 | 2006 ,
7
Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing
Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing
Cho Kyu-Chul, | 한국재료학회 | 2006 ,
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