본문

  1. Home
8 Results:AA:EUI GOO CHANG NAM HOON KIM 0.187 sec.
RSS 
다국어입력
 상세검색
 신착검색
선택출력 선택엑셀내보내기
1
반도체 : 금속 CMP 공정시 경질 다공성 패드의 적용
반도체 : 금속 CMP 공정시 경질 다공성 패드의 적용
김상용 ( Sang Yong Kim ), | 한국전기전자재료학회 | 2003 ,
2
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Tae Gun Kim, | 한국전기전자재료학회 | 2005 ,
3
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
4
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Roles of Phosphoric Acid in Slurry for Cu and TaN CMP
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
5
Investigations on the Etching of Platinum Film using High Density Inductively Coupled Ar/Cl2/HBr Plasmas
Investigations on the Etching of Platinum Film using High Density Inductively Coupled Ar/Cl2/HBr Plasmas
Nam Hoon Kim, | 한국전기전자재료학회 | 2001 ,
6
Regular Paper / A Study on Pumping Effect of Oxygen in Polysilicon Gate Etching
Regular Paper / A Study on Pumping Effect of Oxygen in Polysilicon Gate Etching
Nam Hoon Kim, | 한국전기전자재료학회 | 2001 ,
7
Stability of H2O2 as an Oxidizer for Cu CMP
Stability of H2O2 as an Oxidizer for Cu CMP
Do Won Lee, | 한국전기전자재료학회 | 2005 ,
8
A Study on the Optimized Copper Electrochemical Plating in Dual Damascene Process
A Study on the Optimized Copper Electrochemical Plating in Dual Damascene Process
Hae Young Yoo, | 한국전기전자재료학회 | 2005 ,
처음1마지막