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1
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Myung Jin Yim, | 대한금속재료학회 | 2006 ,
2
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Effects of Packaging Methods on the Meat Quality of a-Tocopherol Supplemented Broiler Chicks during Refrigerated Storage
Youn-Chul Ryu, Min-Suk Rhee, Moo-Ha Lee, Sung-Ki, | Korean Societyof Food Science&Technology | 2006 ,
3
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Myong-Soo Chung, Sang-Hyun Lee, Young-Sun You, Hy, | Korean Societyof Food Science&Technology | 2006 ,
4
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Jong Nam Park, Jang Hyn Kyoung, Wie Soo Kang, Che, | 한국원예학회 | 2006 ,
5
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Jong Nam Park, Jang Hun Kyoung, Cheon Soon Jeong, | 한국원예학회 | 2006 ,
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1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]