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1
Excitation Transport by the Resonant Dipole-Dipole Interaction in a Closely Packed Quantum-Dot Film
Excitation Transport by the Resonant Dipole-Dipole Interaction in a Closely Packed Quantum-Dot Film
Suc-kyoung Hong., | 한국물리학회 | 2006 ,
2
Coherent Squeezed-State Representation of Traveling General Gaussian Wave Packets
Coherent Squeezed-State Representation of Traveling General Gaussian Wave Packets
Sang Pyo Kim., | 한국물리학회 | 2006 ,
3
Bouncing Wave Packets in a Two-Dimensional Box and Revivals Without Semiclassical Correspondence
Bouncing Wave Packets in a Two-Dimensional Box and Revivals Without Semiclassical Correspondence
Sang Pyo Kim., | 한국물리학회 | 2006 ,
4
Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Using a Corrugated Bridge with HRS MEMS Package
Low Actuation Voltage Capacitive Shunt RF-MEMS Switch Using a Corrugated Bridge with HRS MEMS Package
Yo-Tak Song., | 한국전자파학회 | 2006 ,
5
Wave Packet for a Charged Particle in an Oscillating Electric Field
Wave Packet for a Charged Particle in an Oscillating Electric Field
Kim, Sang Pyo, | 한국물리학회 | 2006 ,
6
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
High Frequency Properties of Anisotropic Conductive Films (ACFs) for Flip Chip Package Application
Myung Jin Vim, | 대한금속재료학회 | 2006 ,
7
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Myung Jin Yim, | 대한금속재료학회 | 2006 ,
8
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
K. W. Lee, | 대한금속재료학회 | 2006 ,
9
반도체 Package 공정용 emc gun에 관한 연구
반도체 Package 공정용 emc gun에 관한 연구
조명현, | 대한전자공학회 | 2006 ,
10
Adaptive Cross-Layer Packet Scheduling Method for Multimedia Services in Wireless Personal Area Networks
Adaptive Cross-Layer Packet Scheduling Method for Multimedia Services in Wireless Personal Area Networks
Kim, SungWon, | 한국통신학회 | 2006 ,
처음12이후마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]