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1
Antioxidant and Antimicrobial Activities of Fermentation and Ethanol Extracts of Pine Needles (Pinus densiflora)
Antioxidant and Antimicrobial Activities of Fermentation and Ethanol Extracts of Pine Needles (Pinus densiflora)
Moon-Hyun Yim, | 한국식품과학회 | 2006 ,
2
Comparison of Plot Sizes for Forest Inventory in Natural Deciduous Forest in Korea
Comparison of Plot Sizes for Forest Inventory in Natural Deciduous Forest in Korea
Jong-Su Yim, | 한국임학회 | 2006 ,
3
Synthesis and Properties of Ionic Liquids:Imidazolium Tetrafluoroborates with Unsaturated Side Chains
Synthesis and Properties of Ionic Liquids:Imidazolium Tetrafluoroborates with Unsaturated Side Chains
Min, Gwan-Hong, | 대한화학회 | 2006 ,
4
Physical and Electrical Characteristics of Atomic-Layer-deposited Hf-Silicate Thin Films Using Hf[N(CH₃)(C₂H5)]₄and SiH[N(CH₃)₂]₃ Precursors
Physical and Electrical Characteristics of Atomic-Layer-deposited Hf-Silicate Thin Films Using Hf[N(CH₃)(C₂H5)]₄and SiH[N(CH₃)₂]₃ Precursors
K. B. Chung, | 한국물리학회 | 2006 ,
5
Electrical Properties of the ZnO Nanowire Transistor and Its Analysis with Equivalent Circuit model
Electrical Properties of the ZnO Nanowire Transistor and Its Analysis with Equivalent Circuit model
C. Y. Yim., | 한국물리학회 | 2006 ,
6
Semiconductor Quantum Dots Emitting at 1.5 ??m :Optical Properties and Device Applications
Semiconductor Quantum Dots Emitting at 1.5 ??m :Optical Properties and Device Applications
N. J. Kim., | 한국물리학회 | 2006 ,
7
Physical and Electrical Characteristics of Atomic-Layer-Deposited Hf-Silicate Thin Films Using Hf[N(CH₃)(C₂H5)]₄ and SiH[N(CH₃)₂]₃ Precursors
Physical and Electrical Characteristics of Atomic-Layer-Deposited Hf-Silicate Thin Films Using Hf[N(CH₃)(C₂H5)]₄ and SiH[N(CH₃)₂]₃ Precursors
Chung, K. B., | 한국물리학회 | 2006 ,
8
Dynamic Behaviors of an Elastically Restrained Beam Carrying a Moving Mass
Dynamic Behaviors of an Elastically Restrained Beam Carrying a Moving Mass
Bone-Jo Ryu., | 대한기계학회 | 2006 ,
9
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Review of Electrically Conductive Adhesive Technologies for Electronic Packaging
Myung Jin Yim, | 대한금속재료학회 | 2006 ,
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