본문

  1. Home
1 Results:SS:SPECKLE 0.110 sec.
RSS 
Multilingual
 Расширенный поиск
 Новый поиск книги прибытия
Selected Print Select Export to Excel
1
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry
Koungsuk Kim, Kisoo Kang, Seungtack Jung, | 대한기계학회 | 2005 ,
처음1마지막