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1
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Shin Bok Lee, Young Ran Yoo, Ja-Young Jung, Young, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Joo Won Lee, Sung K. Kang, Hyuck Mo Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
3
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Moon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-, | 한국마이크로전자및 패키징학회 | 2005 ,
4
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Kyu-Sang Chae, Jae-Sang Min, Ik-Joo Kim, Il-Je Cho, | 한국마이크로전자및 패키징학회 | 2005 ,
5
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung, | Metals and Materials | 2005 ,
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