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1
Giga-Hertz-Level Electromagnetic Field Analysis for Equivalent Inductance Modeling of High-Performance SoC and SiP Designs
Giga-Hertz-Level Electromagnetic Field Analysis for Equivalent Inductance Modeling of High-Performance SoC and SiP Designs
Jason, J. Yao, Keh-Jeng Chang, Wei-Che Chuang, an, | 대한전자공학회 | 2005 ,
2
SnAgCu 솔더 라인의 Electromigration 특성 분석
SnAgCu 솔더 라인의 Electromigration 특성 분석
고민구, 윤민승, 김빛나, 주영창, 김오한, 박영배, | 한국마이크로전자및 패키징학회 | 2005 ,
3
공정조성 SnPb 솔더에 대한 실시간 Electromigration 거동 관찰
공정조성 SnPb 솔더에 대한 실시간 Electromigration 거동 관찰
김오한, 윤민승, 주영창, 박영배, | 한국마이크로전자및 패키징학회 | 2005 ,
4
Study on Charge Transport in Nanoscale Organic Monolayers for Molecular Electronics Using Liquid Phase Electrodes
Study on Charge Transport in Nanoscale Organic Monolayers for Molecular Electronics Using Liquid Phase Electrodes
Jinha Hwang, | 한국마이크로전자및 패키징학회 | 2005 ,
5
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
J. S. Bae, G. H. Chang, J. H. Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
6
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Moon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-, | 한국마이크로전자및 패키징학회 | 2005 ,
7
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Kyu-Sang Chae, Jae-Sang Min, Ik-Joo Kim, Il-Je Cho, | 한국마이크로전자및 패키징학회 | 2005 ,
8
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
김영후, 박영배, Reiner Moning, Cynthia A. Volkert, 주영창, | 한국마이크로전자및 패키징학회 | 2005 ,
9
Bioleaching of Electronic Scrap using Thiobacillus ferrooxidans
Bioleaching of Electronic Scrap using Thiobacillus ferrooxidans
Jae-Woo Ahn, Jinki Jeong, Jae-Chun Lee, Dong-Gin, | 한국암반공학회 | 2005 ,
10
Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment
Electroless Ni Plating on PC to Improve Adhesion by DBD Plasma Treatment
T. H. Song, J. K. Lee, S. Y. Park, | 한국부식방식학회(구)한국부식학회 | 2005 ,
처음123이후마지막
1
Active & Passive Electronic Components
Taylor & Francis Ltd [, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
3
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
4
American Journal of Electroneurodiagnostic Technology
American Society of Electroneurodiagnostic Technologists [, ]
5
American Journal of Electroneurodiagnostic Technology
American Society of Electroneurodiagnostic Technologists [, ]
6
Columbia Electronic Encyclopedia, 6th Edition
Columbia University Press [, ]
7
Electro- & Magnetobiology
Marcel Dekker Inc. [, ]
8
Electrolytes & Blood Pressure
대한전해질학회 [의학, ]
9
Electromagnetics
Taylor & Francis Ltd [, ]
10
Electronic Ardell Wellness Report (E-AWR)
Ardell [, ]
11
Electronic Design
Penton Publishing [, ]
12
Electronic Education Report
SIMBA Information Inc. [, ]
13
Electronic Green Journal
Electronic Green Journal [, ]
14
Electronic Journal of Applied Statistical Analysis
Electronic Journal of Applied Statistical Analysis (EJASA) [, ]
15
Electronic Journal of Biomedicine
Electronic Journal of Biomedicine [, ]
16
Electronic Journal of Differential Equations
South West Texas State University [, ]
17
Electronic Journal of Environmental, Agricultural & Food Chemistry
Electronic Journal of Environmental, Agricultural & Food Chemistry [, ]
18
Electronic Journal of Natural Sciences
Presidium of National Academy of Sciences, Republic of Armenia [, ]
19
Electronic Journal of Pathology & Histology
IOS Press [, ]
20
Electronic Journal of Qualitative Theory of Differential Equations
Bolyai Institute [, ]