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1
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB
Shin Bok Lee, Young Ran Yoo, Ja-Young Jung, Young, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Effects of Temperature Amplitude an Loading Frequency on Alternating Current-Induced Damage in Cu Thin Films
Effects of Temperature Amplitude an Loading Frequency on Alternating Current-Induced Damage in Cu Thin Films
Young-Bae Park, | 한국마이크로전자및 패키징학회 | 2005 ,
3
Effect of Microstructure on Alternating Current-induced Damage in Cu Lines
Effect of Microstructure on Alternating Current-induced Damage in Cu Lines
Young Bae Park, | 한국마이크로전자및 패키징학회 | 2005 ,
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