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Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Development and Verification of PZT Actuating Micro Tensile Tester for Optically Functional Materials
Development and Verification of PZT Actuating Micro Tensile Tester for Optically Functional Materials
Seung-Soo Kim, Hye-Jin Lee, Hyoung-Wook Lee, Nak-, | The Korean Institute of Electrical Eng. | 2005 ,
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