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Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Robust State Estimation Based on Sliding Mode Observer for Aeroelastic System
Robust State Estimation Based on Sliding Mode Observer for Aeroelastic System
In-Joo Jeong, Sungsoo Na, Myung-Hyun Kim, Jae-Hon, | 대한기계학회 | 2005 ,
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