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1
분산객체그룹 프레임워크 기반의 헬스케어 홈 서비스 시스템의 제안
분산객체그룹 프레임워크 기반의 헬스케어 홈 서비스 시스템의 제안
장재호 ( Jae Ho Jang ), | 한국정보처리학회 | 2005 ,
2
Trusted Certificate Validation Scheme for Open LBS Application Based on XML Web Services : Communication System and Security
Trusted Certificate Validation Scheme for Open LBS Application Based on XML Web Services : Communication System and Security
Ki Young Moon, | 한국정보처리학회 | 2005 ,
3
Isolation and Structural Determination of Aldose Reductase Inhibitor from Korean Fermented Soybean Paste
Isolation and Structural Determination of Aldose Reductase Inhibitor from Korean Fermented Soybean Paste
Sung Won Choi, | 한국식품과학회 | 2005 ,
4
Optimization of Screw Pumping System (SPS) for Mass Production of Entrapped Bifidus
Optimization of Screw Pumping System (SPS) for Mass Production of Entrapped Bifidus
Ji Sung Ryu, | 한국식품과학회 | 2005 ,
5
Eu-doped LGF Luminescent Down Converter Possible for TiO2 Dye Sensitized Solar Cells
Eu-doped LGF Luminescent Down Converter Possible for TiO2 Dye Sensitized Solar Cells
Hyun Ju Kim, | 한국전기전자재료학회 | 2005 ,
6
Spray-coated Carbon Nanotube Counter Electrodes for Dye-sensitized Solar Cells
Spray-coated Carbon Nanotube Counter Electrodes for Dye-sensitized Solar Cells
Won Jae Lee, | 한국전기전자재료학회 | 2005 ,
7
Properties of Photovoltaic Cell using ZnPc/C60 Double Layer Devices
Properties of Photovoltaic Cell using ZnPc/C60 Double Layer Devices
Ho Sik Lee, | 한국전기전자재료학회 | 2005 ,
8
Characteristics of Nano-crystalline TiO2 Dye-sensitized Solar Cells having Counter Electrodes with Different Preparing Process
Characteristics of Nano-crystalline TiO2 Dye-sensitized Solar Cells having Counter Electrodes with Different Preparing Process
Dong Yoon Lee, | 한국전기전자재료학회 | 2005 ,
9
Effect of Process Parameters on the Efficiency of Dye Sensitized Solar Cells
Effect of Process Parameters on the Efficiency of Dye Sensitized Solar Cells
Won Jae Lee, | 대한금속재료학회 | 2005 ,
10
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Interconnection Process and Electrical Properties of the Intercomection Joints for 3D Stack Package with 75um Cu Via
Kwang-Yong Lee, Teck-Su Oh, Hye-Jin won, Jae-Ho L, | 한국마이크로전자및 패키징학회 | 2005 ,
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