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1
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Dissolution of Cu Into Sn-Bases Solders during Reflow Slldering
Jong-Hyun Lee,Dong-Hyuk Shin,Yong-Seog Kim, | 대한금속.재료학회 | 2003 ,
2
Sn-3.5Ag. Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3. 0In-0.5Bi Solder를 이용한 μBGA Solder 접합부의 열피로 수명예측
Sn-3.5Ag. Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3. 0In-0.5Bi Solder를 이용한 μBGA Solder 접합부의 열피로 수명예측
김연성,김형일,김종민,신영의, | 대한용접학회 | 2003 ,
3
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Jin-Won Choi,Ho-Seob Cha, | 대한금속.재료학회 | 2003 ,
4
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Jeong-Won Yoon,Chang-Bae Lee, | 대한금속.재료학회 | 2003 ,
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