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1
Evaluation of Citric Acid Added Cleaning Solution for Removal of Metallic Contaminants on Si Wafer Surface
Evaluation of Citric Acid Added Cleaning Solution for Removal of Metallic Contaminants on Si Wafer Surface
Hye-Young Chung, Kyung-Soo Kim, Hyo-Yong Cho, Bo-, | 한국화학공학회 | 2001 ,
2
Preparations of Silica Slurry for Wafer Polishing via Controlled Growth of Commercial Silica Seeds
Preparations of Silica Slurry for Wafer Polishing via Controlled Growth of Commercial Silica Seeds
Jae-Hyun So, Sun Hyuk Bae Seung-Man Yang, Do Hyun, | 한국화학공학회 | 2001 ,
3
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
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