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1
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Package- and Wafer Level Electromigration Test on Al-Cu interconnect with Ti and TiN Underlayers
Young Bae Par, Dok Won Lee, | 대한금속.재료학회 | 2001 ,
2
Package design in Japan biennual, 9
Package design in Japan biennual, 9
Japan package design association and rikuyosha,, 658-J35p | Rikuyosha | 2001 658-J35p,
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