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1
Improvement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound
Improvement of Adhesion strength between Cu-based Leadframe and Epoxy Molding Compound
Ho Young Lee, | 한국전기전자재료학회 | 2001 ,
2
An Interpretation of the Failure Paths of Roughened Matal-Polymer Interfaces
An Interpretation of the Failure Paths of Roughened Matal-Polymer Interfaces
Ho-Young Lee,Jianmin qu, | 대한금속.재료학회 | 2001 ,
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